led 培訓(xùn)課程

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1、科宏光電（深圳）有限公司 電話 0755-61526239 華先生：13430902080 郵箱：elvis@ QQ：2355776683 LED培訓(xùn)課程 Led training course 一、 Five original material of LED The five original material of led Respectively refers to：chip, lead frame, Silver Epoxy (insulation glue),gold wire, epoxy resin. 1、 晶片Chip 1） 晶片的構(gòu)成

2、：由金墊、P極、N極、PN結(jié)，背金層構(gòu)成（雙pad晶片無背金層）composition of chip：gold pads, P pole, N pole, p-n junction, back gold layer (double pad chip has no back gold layer) 2） 晶片的定義：晶片是由P層半導(dǎo)體元素，N層半導(dǎo)體元素靠電子移動(dòng)而重新排列組合在的PN結(jié)合體，也正是這種變化使晶片能夠處于一個(gè)相對(duì)穩(wěn)定的狀態(tài)。definition of chip：the chip is a new combination of p-n junction semiconducto

3、r element by the P-layer, an N-layer semiconductor element by the electronic mobile rearrange ，and it is this change so that the chip can be in a relatively stable state. 3） 晶片的發(fā)光原理：在晶片被一定的電壓施加正向電極時(shí)，正向P區(qū)的空穴則會(huì)源源不斷的游向N區(qū)，N區(qū)的電子則會(huì)相對(duì)于孔穴向P區(qū)運(yùn)動(dòng)。在電子，空穴相對(duì)移動(dòng)的同時(shí)，電子空穴互相結(jié)對(duì)，激發(fā)出光子，產(chǎn)生光能。 luminous principle of chip：

4、when applying a certain voltage in positive electrode of the chip，the hole of positive P area will continuously swam to N area, electron of N area will move to P area relatively .electron and hole get combination of each other，stimulate photons, create light at the same time。 2、 支架 Lead frame 2

5、．1）支架的結(jié)構(gòu)：層鐵，層鍍銅（導(dǎo)電性好，散熱快），層鍍鎳（防氧化）層鍍銀（反光性好，易焊線）struction of lead frame：layer iron, layer copper plating（good electrical conductivity，fast heat dissipation），Layer nickel plating（anti-oxidation）Layer of silver plating（good reflection，easy to wire bonding） 2．2）支架型號(hào)分類：2002、2003、2004、2009、食人魚.... lead f

6、rame type classification：2002、2003、2004、2009、Piranha.... 3、銀膠Silver Epoxy（因種類較多，以住友F3007-20為例）（for sort is too many，we got zhuyou F3007-20 as an example ） 3．1）組成：銀粉（導(dǎo)電、散熱、固定晶片）+環(huán)氧樹脂（固化銀粉）+稀釋劑（易于攪拌）Composition：silver powder（electrical conductive, heat dissipation, chips bonding）+ epoxy resin（curi

7、ng silver powder）+ diluent (easily stirred) 3．2）使用條件use condition： ①、儲(chǔ)藏條件：3個(gè)月（保存條件：5-15℃）6個(gè)月保存條件15-40℃ DX-20℃其儲(chǔ)存條件為：-20℃6個(gè)月 A、storage condition：3 mouths（storage conditions：5-15℃）6mouths （storage conditions 15-40℃） DX-20℃storage conditions：-20℃ 6 mouths ②、烘烤條件：150℃/1.5H baking Conditio

8、n：150℃/1.5H ③、順一個(gè)方向均勻攪拌15分鐘 one direction Stir 15 minutes 3．3）解凍及分裝步驟 thaw and subpackage steps： ①、從冷柜中取出銀膠，在其密封狀態(tài)下置入室溫25℃中，1小時(shí)讓其自然解凍（期間不能開封）A,take out Silver Epoxy from refrigerator， put it in room temperature 25 ℃ in its seal condition，1 hour for its natural thaw（do not open during this peri

9、od） ②、用干凈的無塵紙或布將瓶外面凝集的水氣擦拭干凈，然后開啟密封膠及瓶蓋并拭凈周圍水氣Wiping clean steam agglutinate out of the bottle with a a clean, dust-free paper or cloth?, and then open the sealant and cap and scrubbed around moisture?. ③、將整瓶銀膠用針筒分裝成若干小支并將每小支密封好（一次生將此瓶銀膠分裝完）并標(biāo)明分裝重量、日期、分裝針筒號(hào)，使用時(shí)依據(jù)針筒號(hào)順序使用，除當(dāng)班需使用的小支外，其余小支銀膠必需即放入

10、-20℃以下的冷柜內(nèi)，以備后續(xù)使用。 The?whole?bottle?of?silver?glue?will?subpackage?into?some?small?needle?cylinder,?And?every?small?teams?will?be?sealed.(This?bottle?silver?glue?will?completely?subpackage?at?one?time)?And?marked?subpackage?weight、?date?needle?cylinder?number，?according?to?the?sequence?of?cylinder?

11、number?,?you?use?the?silver?glue.?In?addition?to?you?use?the?needle?cylinder?,?The?rest?of?the?small?branch?silver?glue?must?be?put?in?the?freezer?blow?20?degrees?Celsius?which?use?in?the?later. ④、銀膠注意事項(xiàng)（銀膠絕緣膠操作規(guī)程指導(dǎo)書）notes of silver epoxy（operating rules instruction of silver epoxy and insulation p

12、aste） 4、金線（0.8㏕、0.9㏕、1.0㏕、1.2㏕）gold wire 4．1）金線用途（作用）：gold wire usage： 利用其含金量高材質(zhì)較軟、易變形且導(dǎo)電性好、散熱性好的特性，讓晶片與支架間形在一閉合電路 Take advantage of its high gold content、relatively soft、 easily deformed and good electrical conductivity, good heat dissipation characteristics, shaped in a closed circuit

13、 between the chip and the lead frame。 5、環(huán)氧樹脂epoxy resin 5．1）組成：A、B兩組劑份composition：A, B two groups of agents copies A膠：是主劑，由環(huán)氧樹脂+消泡劑+耐熱劑+稀釋劑 the main agent，epoxy resin + defoamer + Heat Resistant Agents + diluent B膠：是固化劑，由酸酣+離模劑+促進(jìn)劑curing agent，Acid freed + release agent

14、+ accelerator 5．2）使用條件：Conditions of use: 混合比：A/B=100/100（重量比）Mixing ratio：A/B=100/100（weight ratio） 混合粘度：500-700cps/30℃ Mixed viscosity：500-700cps/30℃ 膠化時(shí)間：130℃=45分鐘 Gel time：130℃=45分鐘 可使用條件：室溫25℃約5H，一般根據(jù)產(chǎn)線生產(chǎn)需要將它的使用條件定為2H。available conditions：room temperature

15、 25℃ about 5H，generally we set its condition of use at 2 hours according to production line’s needs 硬化條件：短烤130℃=45分鐘，長(zhǎng)烤120℃=7小時(shí) Hardening conditions：short bake 130℃=45 minutes，long bake 120℃7 hours 二、LED四大制程工藝LED four manufacture process technology ① 固晶工藝 chips bonding ② 焊線工藝

16、wire bonding ③ 封膠工藝epoxy pouring ④ 測(cè)試工藝 testing 固晶工藝chips bonding 1、 銀膠解凍：將已分裝好的小瓶（為保證沒用到的銀膠保存質(zhì)量）銀膠從凍箱里取出，置于干燥通風(fēng)處解凍，直至瓶子表面沒有水珠后，按一定方向，一定速度攪拌15分鐘，后將解凍好的銀膠裝入針筒（手動(dòng)線）或裝在銀膠盤上（自動(dòng)線）。 silver glue thaw：take the subpackaged small bottle of silver glue（to ensure the quality of remain ning silver glue

17、）out of refrigerator，place in a dry and well-ventilated place thaw until the bottle surface waterless, then stirring 15 minutes according to a certain direction and a certain speed. Put the thawed silver glue into the cylinder（Manual production line）or into the silver glue disc（automatic production

18、 line）. 2、 解凍的目的：易作業(yè)。攪拌的目的；使銀膠的成份分布均勻。 Thawing Objective：Easy operate。Stirring objective: ensure that silver glue ingredient uniform distribution。 3、 排支架：將支架按一定方向（陰陽極一致）排好。（好處：便于點(diǎn)膠作業(yè)） arrange lead frame：put lead frames in a certain direction (anode and cathode unanimous). (Advantages: easy

19、to dispensing) 4、 點(diǎn)膠：就是將銀膠點(diǎn)在支架的陽極或陰極之固晶位的中心位上。點(diǎn)膠量在1/3≥晶片高度≥1/4。 Dispensing：Dot silver epoxy into the center of chip bonding place which located at anode or cathode in lead frame， The dispensing amount in 1/3 ≥ chip height ≥ 1/4. 5、 固晶：將晶片固定在已點(diǎn)好銀膠的支架上。固晶的位置不能偏離中主位1/3。 chip bonding：The chip will b

20、e fixed in the Dispensed lead frame. Chip bonding position can't deviate from the main a 1/3. 6、 固晶烘烤：150℃/1.5小時(shí)。注意：烘烤過程中不能開烤箱。 baking：150℃/1.5小時(shí)。Note：do not open the oven during baking proces. 7、 固晶的推力≥100g. the thrust of bonded chip≥100g. 晶粒暗崩，固偏，漏固，反固，疊固，晶粒破損，浮壓，錯(cuò)固，晶粒側(cè)面沾膠，晶粒表面沾膠，支架杯壁沾膠，銀膠內(nèi)

21、有雜質(zhì)，晶粒pad破損，pad氧化，背金層脫落，推力不夠，銀膠過多，銀膠過少等。晶粒暗崩，patial bond，leakage bond，反固，overlapped bond，chip damage，浮壓，錯(cuò)固，chip side is stained glue，chip surface is stained glue，lead frame reflactor is stained glue，silver epoxy impurity，chip pad damage，pad oxidation，Back gold layer falls off，thrust is not enough，S

22、ilver epoxy too much，Silver epoxy too little,etc. 焊線工藝wire bonding 1、 檢查焊線機(jī)電源是否正常。 check the power supply of wire bonding machine is normal or not 2、 將焊線機(jī)電源打開，并探測(cè)第一點(diǎn)高度。 turn on the power supply ofwire bonding machine，And detecting the first point height 3、 根據(jù)操作者的習(xí)慣，調(diào)整第一焊線點(diǎn)及第二焊線點(diǎn)的高度。 Ac

23、cording to the habit of the operator，adjust the first welding line point and second welding line point height. 4、 根據(jù)產(chǎn)品的要求設(shè)定焊線溫度（雙電極的材料一般為190℃±5℃，單電極的材料為220℃-280℃、時(shí)間（10-25）、功率（-0-180）、壓力（35-70）后進(jìn)行焊線。 Setting wire bonding temperature according to the requirements of the product (double electrode mat

24、erial generally is 190 ℃ ± 5 ℃, single electrode materials is 220 ℃ - 280 ℃, time (10-25), power (0-180), pressure (35-70) ,then bond wire. 5、 焊線要求：wire bonding requirement： 焊球的大小為3倍線徑（約占pad面積大小的80%-90%）The size of solder ball is three times the wire diameter（Accounts for about 80% - 90% of the pa

25、d size） 焊線的拉力≥5g The tension of bonded wire≥5g 焊線的不良 1、 虛焊（焊線的壓力或功率、時(shí)間、溫度不夠）、焊球重疊（操作不當(dāng)）、晶片電極打穿（焊線溫度過高、壓力過大、多次焊線、來料不良）偏焊、雜線、弧度過高或過低、線尾過長(zhǎng)或焊球過大、拔晶、拉力不夠（焊線的壓力或功率、時(shí)間、溫度不夠；晶片pad氧化或有雜物、支架焊線區(qū)氧化或雜物；金線被刮傷）。cold solder （wire bonding pressure or power, time, temperature is not enough）、Welding ball ov

26、erlapping（improper operation）、chip electrode penetrated (soldering temperature is too high, the pressure is too large, multiple wire bonding, incoming material badness)partial welding, miscellaneous line，radian is too high or too low, the tail is too long or Gold ball is too large, pulling the cryst

27、al, the tension is not enough (wire bonding pressure or power, time, temperature is not enough; chip pad oxidation or impurity、 wire bonding zone oxidation or debris; gold wire scratches). 2、將模條按一定的方向裝在鋁船上。后進(jìn)行吹塵后置入125℃/40分鐘的烘箱內(nèi)進(jìn)行預(yù)熱。 3、根據(jù)生產(chǎn)的需求量進(jìn)行配膠，后將已配好的膠攪拌均勻后置入45℃-55℃=15分鐘的真空烘箱內(nèi)進(jìn)行脫泡。Preparati

28、ng glue according to the demand of production, uniform mixing and put it in a 45℃-55℃a vacuum oven for degassing about 15 minutes. 4、進(jìn)行灌膠，后進(jìn)行初烤（3Φ、5Φ的產(chǎn)品初烤溫度為125℃/80分鐘；8Φ-10Φ的產(chǎn)品初烤溫度為110℃/60分鐘 glue pouring，then initial bake（the Initial bake temperature of3Φ、5Φis 125℃/80minutes；8Φ-10Φ is 110℃/60 minut

29、es 5、進(jìn)行離模，后進(jìn)行長(zhǎng)烤130℃/7小時(shí)。Release mold，long bake 130℃/7 hours。 6、支架插偏、支架插深、支架插淺、支架插反、支架爬膠、支架變黃（氧化、烘烤溫度過高或時(shí)間過長(zhǎng)）碗氣泡、珍珠氣泡、線性氣泡、表面針孔氣泡。雜質(zhì)、多膠、少膠、霧化、膠面水紋、膠體損傷、膠體龜裂（膠水老化或比例不對(duì)）膠體變黃（A膠比例過大）。 Lead frame plug patial、Lead frame plug deep、Lead frame plug shallow、Lead frame Plug back、 Lead frame is stained glue、

30、Lead frame turn yellow（Oxidation, baking temperature too high or too long）Bowl bubble、Pearl bubble、Linear bubble、Surface pinhole bubble. Impurities, much glue, less glue, atomization, water lines on the glue surface, colloid injury, colloid crack (glue aging or proportional wrong) colloid turn yell

31、ow (A glue on a massive scale). 1、 按共陽或共陰的方式進(jìn)行一切 first cut base on the common anode or common cathode. 2、 電性測(cè)試（紅黃VF：1.7-2.4V、IF：20mA (單顆晶粒) 40mA（雙顆晶粒）VR：5V、IR：0-10u A;藍(lán)綠白VF：2.8-4.5V、IF：20mA (單顆晶粒) 40mA（雙顆晶粒）VR：5V、IR：0-10u A，外觀檢驗(yàn)。 Electrical test（RY VF：1.7-2.4V、IF：20mA (one chip) 40mA（two chips

32、）VR：5V、IR：0-10u A;BGW VF：2.8-4.5V、IF：20mA (one chip) 40mA（two chips）VR：5V、IR：0-10u A，check appearance。 3、 進(jìn)行二切（注意勿切平腳）。Second cut （Pay attention to not cutting flat foot）。 測(cè)試的不良 1、 電性不良：VF偏低，VF偏大，IR過大。 Electrical badness：VF patial low，VF patial high，IR too high 。 2、 外觀不良：雜物、氣泡、支架插偏、膠體霧化、膠體損

33、傷、膠體斷頭，等以及前些站的不良項(xiàng)目。 Mal-appearance：sundry, bubble, support plug partial, colloid atomization, colloid injury, colloid beheaded, as well as the other station bad project. 三、質(zhì)量檢驗(yàn)基礎(chǔ)the quality inspection foundation 1、What is the quality inspection 　檢驗(yàn)，是指結(jié)合觀察和判斷，必要時(shí)結(jié)合測(cè)量、試驗(yàn)所進(jìn)行的符合性評(píng)價(jià)，是對(duì)產(chǎn)品或服務(wù)的一種或

34、多種特性進(jìn)行測(cè)量、檢查、試驗(yàn)、計(jì)量，并將這些特性與規(guī)定的要求進(jìn)行比較，以確定其符合性的活動(dòng)。Examination.?The?meaning?is?that?the?conformity?assessment?which?combine?with?observation?and?judgment,?At?the?same?time,?it?is?necessary?that?the?conformity?assessmentcombine?with?measuring?test?of?conformity?assessment.?And,?one?or?more?characteristics

35、?of?the?product?or?service?are?measured?checked?tested、?measurement??,at?the?same?time?comparing??these? characteristics?and?specified?requirements?so?that?determine?the?conformance??activities? 2、檢驗(yàn)的主要內(nèi)容有the main contents of the inspection （1）熟悉和掌握標(biāo)準(zhǔn)。首先要把有關(guān)的技術(shù)標(biāo)準(zhǔn)轉(zhuǎn)換成具體，明確的質(zhì)量要求和檢驗(yàn)方法。通過標(biāo)準(zhǔn)的具體化，使有關(guān)

36、人員熟悉和掌握分辨產(chǎn)品是合格品還是不合格品的方法。Be familiar with and master the standard。First of all，technical standards relating to conversion should be transformed into specific, clear quality requirements and test methods. for embodiment of the standard，the staff can be familiar with and master the method of distingui

37、sh products from qualified and disqualified （2）抽樣。隨機(jī)抽取樣本，使樣本對(duì)總體具有充分的代表性。當(dāng)然，全數(shù)檢驗(yàn)不存在抽樣問題。spot-check。Random sample drawn, make the overall sample has fully representative. Certainly，full inspection does not exist sampling problems。 （3）測(cè)量。借助量具或量測(cè)儀器對(duì)產(chǎn)品或樣本進(jìn)行測(cè)量。measurement。Measuring products or samples

38、 by means of measuring tool or measuring instrument . （4）比較。把測(cè)量結(jié)果與質(zhì)量標(biāo)準(zhǔn)進(jìn)行比較，確定質(zhì)量特征是否符合要求。Comparation 。Comparing measuring result and quality standard， ensure quality characteristic meets the requirements. （5）判斷。根椐比較的結(jié)果，來判斷被檢產(chǎn)品是否合格，或一批產(chǎn)品是否符合規(guī)定的質(zhì)量標(biāo)準(zhǔn)。judgement。Judge whether products conform to the

39、 quality standards according to the result of comparation （6）處理。對(duì)不合格品進(jìn)行處理；包括對(duì)單件合格品的放行，不合格品分情況回用，返工，返修，降級(jí)和報(bào)廢；dispose。Deal with the disqualified products，including the single qualified permit through, defective goods points reuse, rework, repair, degradation and scrap. （7）記錄。記錄測(cè)量的數(shù)據(jù)，并進(jìn)行整理，統(tǒng)計(jì)和反饋，向有關(guān)部門提供質(zhì)量信息，以促進(jìn)各部門改進(jìn)質(zhì)量。record。Record measurement data，arranging, statistics and feedback, provide quality information to relevant departments, in order to promote various departments to improve the quality of products.